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Rfstar Cc2340 Wireless Transceiver Module Bluetooth Zigbee with Uart Transmission for Motion Sensor

Name: Rfstar Cc2340 Wireless Transceiver Module Bluetooth Zigbee with Uart Transmission for Motion Sensor
Brand: Shenzhen Rf-Star Technology Co., Ltd.
SKU: sAepqDiEhTWy
Price: 2.50 USD
Availability: InStock

US$2.50 3 Pieces (MOQ)

Port:

Shenzhen, China

Production Capacity:

3000000 PCS/Month

Payment Terms:

T/T, Paypal

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Shenzhen Rf-Star Technology Co., Ltd.

Guangdong, China

Last Login Date:

Feb 11, 2025

Main Products:

Bluetooth Module, BLE Module, Wi-Fi Module, Sub-1GHz Module, Zigbee Module, Lora Module

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Product Description

Company Info

Basic Info.

Model NO.

RF-BM-2340B1I

Usage

ESL,Consumer Electronics,Automobile

Type

Wireless

Support Network

Bluetooth

Information content

Data

Condition

New

Trademark

RF-star

Transport Package

Carton

Specification

22.50 mm * 15.55 mm * 2.1 mm

Origin

China

HS Code

8517629900

Product Description

RF-BM-2340B1 and RF-BM-2340B1I are RF modules based on TI lower-power CC2340R5 SoC. They are multiprotocol

2.4 GHz wireless modules supporting Thread, ZigBee®, Bluetooth® 5.3 Low Energy, IEEE 802.15.4, and proprietary 2.4

GHz. The modules integrate a 48 MHz crystal, 512 KB of in-system Programmable Flash, 12 KB ROM for bootloader,

and 36 KB of ultra-low leakage SRAM. The ARM® Cortex®-M0+ core application processor can operate at an extremely

low current at flexible power modes. And the modules enable long-range and low-power applications using 8 dBm high

power with best-in-class transmit current consumption at 12 mA. They feature a small size, robust connection distance,

and rigid reliability. The 1.27-mm half-hole pitch stamp stick makes the module more convenient for application and

development. RF-BM-2340B1 has a high-performance PCB antenna, while RF-BM-2340B1I has an IPEX connector or

a half-hole RF out interface option for the different needs of external antennas. The UART serial port protocol can also

enable you to start your development with a quick path.

Table 1. The Parameters of RF-BM-2340B1I

Chipset	CC2340R5
Supply Power Voltage	1.8 V ~ 3.8 V, 3.3 V is recommended
Frequency	2360 MHz ~ 2510 MHz
Maximum Transmit Power	+8.0 dBm
Receiving Sensitivity	-102 dBm @ Bluetooth 125 kbps (LE Coded PHY) -99 dBm @ Bluetooth 500 kbps (LE Coded PHY) -96.5 dBm @ Bluetooth 1 Mbps -92 dBm @ Bluetooth 2 Mbps
GPIO	24
Power Consumption	RX current: 5.3 mA TX current: 5.1 mA @ 0 dBm < 11.0 mA @ 8 dBm MCU (CoreMark):2.6 mA@active mode Standby: <710 nA@RTC, 36KB RAM Shutdown: 150 nA @ wake-up on pin
Support Protocol	Bluetooth 5.3 Low Energy, ZigBee, Proprietary, SimpleLink TI 15.4-stack
Crystal	48 MHz, 32.768 kHz
Package	SMT packaging (Half hole)
Communication Interface	UART, SPI, I2C, ADC, RTC
Dimension	22.50 mm × 15.55 mm × 2.1 mm
Type of Antenna	IPEX connector or half-hole ANT pin
Operating Temperature	-40 ºC ~ +85 ºC
Storage Temperature	-40 ºC ~ +125 ºC

Table 2. Pin Diagram of RF-BM-2340B1I

Pin	Name	Chip Pin	Function	Description
1	GND	GND	Ground	Ground
2	GND	GND	Ground	Ground
3	DIO9	DIO9	Digital	GPIO
4	DIO10	DIO10	Digital	GPIO
5	DIO8	DIO8	Digital	GPIO
6	DIO11	DIO11	Digital	GPIO
7	DIO12	DIO12	Digital	GPIO, high-drive capability
8	DIO13	DIO13	Digital	GPIO
9	DIO14	DIO14	Digital	GPIO
10	DIO15	DIO15	Digital	GPIO
11	GND	GND	Ground	Ground
12	VCC	VCCS	VCC	Power supply: 1.71 V ~ 3.8 V, recommended to 3.3 V
13	GND	GND	GND	Ground
14	RESET	RSTN	Digital	Reset, active low. Internal pullup.
15	SWDIO	DIO16_SWDIO	Digital	GPIO, SWD interface: mode select or SWDIO (JTAG_TMSC), high-drive capability
16	SWDCK	DIO17_SWDCK	Digital	GPIO, SWD interface: clock(JTAG_TCKC), high- drive capability
17	DIO18	DIO18	Digital	GPIO, high-drive capability
18	DIO19	DIO19	Digital	GPIO, high-drive capability
19	DIO20	DIO20_A11	Digital or Analog	GPIO, analog capability
20	DIO21	DIO21_A10	Digital or Analog	GPIO, analog capability
21	DIO5	DIO5_A2	Digital or Analog	GPIO, analog capability
22	DIO23	DIO23_A8	Digital or Analog	GPIO, analog capability
23	DIO24	DIO24_A7	Digital or Analog	GPIO, analog capability, high-drive capability
24	DIO25	DIO25_A6	Digital or Analog	GPIO, analog capability
25	DIO0	DIO0_A5	Digital or Analog	GPIO, analog capability
26	DIO1	DIO1_A4	Digital or Analog	GPIO, analog capability
27	DIO2	DIO2_A3	Digital or Analog	GPIO, analog capability
28	DIO22	DIO22_A9	Digital or Analog	GPIO, analog capability
29	DIO6	DIO6_A1	Digital or Analog	GPIO, analog capability
30	DIO7	DIO7_A0	Digital or Analog	GPIO, analog capability
31	GND	GND	Ground	Ground, for RF-BM-2340B1I only
32	ANT	ANT	RF	External ANT output pin, for RF-BM-2340B1I only
33	GND	GND	Ground	Ground, for RF-BM-2340B1I only

Address: C601, Skyworth Building, High-Tech Park, Shenzhen, Guangdong, China

Business Type: Manufacturer/Factory

Business Range: Electrical & Electronics

Management System Certification: ISO 9001, ISO 14001

Main Products: Bluetooth Module, BLE Module, Wi-Fi Module, Sub-1GHz Module, Zigbee Module, Lora Module

Company Introduction: Shenzhen RF-star Technology Co., Ltd., founded in 2010, is a world leading Internet-of-Things (IoT) solution provider. RF-star has the vision of a connected world with widely deployed IoT technology, such as BLE/BT (CC2540, CC2541, CC2640, CC2642, CC2652R, CC2652P, EFR32BG22, nRF51822, nRF51802, nRF52810, nRF52811, nRF52832, nRF52840, nRF52805, nRF52833, RS02A1-A, RS02A1-B), Wi-Fi (CC3200, CC3220, CC3235S, CC3235SF, RTL8710AF, RTL8711AF), LoRa (SX1278, SX1276, SX1262, SX1268, ASR6501, ASR6505), ZigBee (CC2530, EFR32), Sub-1GHz (CC1310, CC1352, CC1352P), RFID, which makes RF-star focus on creating innovative products and services, empowering industries to run intelligently and providing people better lifestyle.

RF-star, a third-party partner (IDH) of Texas Instruments (TI), is aimed to provide the superior wireless connectivity modules, customized RF HW and SW design. We also provide iPhone / Android APP design and the middleware for cloud service, which make RF-star a top-ranking RF system integrator in consumer electronics, industry and military and other fields. What's more, RF-star is highly praised by industry leaders such as TI, Nordic, Qualcomm, Huawei and Realtek.

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