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Cc2652p Zigbee 3.0 Bluetooth 5.1 20 dBm Ipex Antenna Version BLE 5.1 Wireless Module Transceiver Module with Power Amplifier

Name: Cc2652p Zigbee 3.0 Bluetooth 5.1 20 dBm Ipex Antenna Version BLE 5.1 Wireless Module Transceiver Module with Power Amplifier
Brand: Shenzhen Rf-Star Technology Co., Ltd.
SKU: WGmRiyaMqxcI
Price: 4.95 USD
Availability: InStock

US$4.95 3 Pieces (MOQ)

Port:

Shenzhen, China

Production Capacity:

3000000 PCS/Month

Payment Terms:

T/T, Paypal

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Shenzhen Rf-Star Technology Co., Ltd.

Guangdong, China

Last Login Date:

Feb 11, 2025

Main Products:

Bluetooth Module, BLE Module, Wi-Fi Module, Sub-1GHz Module, Zigbee Module, Lora Module

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Product Description

Company Info

Basic Info.

Model NO.

RF-BM-2652P2I

Usage

Zha and Zigbee2mqtt

Type

Wireless

Support Network

BLE,Thread, Zigbee,6lowpan,Proprietary

Information content

Data

Certification

CE, FCC

Condition

New

Trademark

RF-star

Transport Package

Carton

Specification

30.0 mm * 16.4 mm * 2.2 mm

Origin

China

HS Code

8517629900

Product Description

RF-BM-2652P2(I) is an RF module based on TI lower-power CC2652P SoC, which is a multiprotocol 2.4 GHz wireless module supporting Thread, Zigbee®, Bluetooth® 5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. It integrates a 48 MHz crystal and a 32.768 kHz crystal, 352 KB of in-system Programmable Flash, 256 KB ROM, 8 KB of Cache SRAM, and 80 KB of ultra-low leakage SRAM. Its ARM® Cortex®-M4F core application processor can operate at an extremely low current at flexible power modes. And the module enables long-range and low-power applications using an integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 85 mA. It features a small size, robust connection distance, and rigid reliability. Optional antenna output modes (PCB, IPEX connector, and half-hole interface) make the module more convenient for application and development

Table 1. The Parameters of RF-BM-2652P2I

Chipset	CC2652P
Supply Power Voltage	1.8 V ~ 3.8 V, 3.3 V is recommended
Frequency	2402 MHz ~ 2480 MHz
Maximum Transmit Power	+20.0 dBm
Receiving Sensitivity	-100 dBm @ 802.15.4 (2.4 GHz) -105 dBm @ Bluetooth 125 kbps (LE Coded PHY)
GPIO	23
Power Consumption	RX current: 6.9 mA TX current: 7.3 mA @ 0 dBm 9.6 mA @ 5 dBm 22 mA @ 10 dBm 85 mA @ dBm MCU 48 MHz (CoreMark):3.4 mA (71 μA/MHz) Sensor Controller:30.1 μA @ Low Power-Mode, 2 MHz, running infinite loop 808 μA @ Active-Mode, 24 MHz, running infinite loop Standby: 0.94 µA Shutdown: 150 nA
Support Protocol	Thread, ZigBee, BLE5.3, IEEE 802.15.4, 6LoWPAN, proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz)
Crystal	48 MHz, 32.768 kHz
Package	SMT packaging (Half hole)
Communication Interface	UART, SPI, I2C, I2S
Dimension	30.0 mm × 16.4 mm × 2.2 mm
Type of Antenna	IPEX connector, ANT pin
Operating Temperature	-40 ºC ~ +85 ºC
Storage Temperature	-40 ºC ~ +125 ºC

Table 2. Pin Diagram of RF-BM-2652P2I

Pin	Name	Chip Pin	Function	Description
1	DIO5	DIO_5	Digital	GPIO, high-drive capability
2	DIO6	DIO_6	Digital	GPIO, high-drive capability
3	DIO7	DIO_7	Digital	GPIO, high-drive capability
4	DIO8	DIO_8	Digital	GPIO
5	DIO9	DIO_9	Digital	GPIO
6	DIO10	DIO_10	Digital	GPIO
7	DIO11	DIO_11	Digital	GPIO
8	DIO12	DIO_12	Digital	GPIO
9	DIO13	DIO_13	Digital	GPIO
10	RES	RESET_N	Digital	Reset, active low. Internal pullup.
11	JTAG_TMSC	JTAG_TMSC	Digital	JTAG TMSC, high-drive capability
12	JTAG_TCKC	JTAG_TCKC	Digital	JTAG TCKC
13	VCC	VCC	-	Power supply: 1.8 V ~ 3.8 V, recommended to 3.3 V
14	GND	GND	Ground	Ground
15	DIO14	DIO_14	Digital	GPIO
16	DIO15	DIO_15	Digital	GPIO
17	DIO16	DIO_16	Digital	GPIO, JTAG_TDO, high-drive capability
18	DIO17	DIO_17	Digital	GPIO, JTAG_TDI, high-drive capability
19	DIO18	DIO_18	Digital	GPIO
20	DIO19	DIO_19	Digital	GPIO
21	DIO20	DIO_20	Digital	GPIO
22	DIO21	DIO_21	Digital	GPIO
23	DIO22	DIO_22	Digital	GPIO
24	DIO23	DIO_23	Digital or Analog	GPIO, analog capability
25	DIO24	DIO_24	Digital or Analog	GPIO, analog capability
26	DIO25	DIO_25	Digital or Analog	GPIO, analog capability
27	DIO26	DIO_26	Digital or Analog	GPIO, analog capability
28	DIO27	DIO_27	Digital or Analog	GPIO, analog capability
29	GND	GND	Ground	Ground
30	ANT		-	External antenna interface

Address: C601, Skyworth Building, High-Tech Park, Shenzhen, Guangdong, China

Business Type: Manufacturer/Factory

Business Range: Electrical & Electronics

Management System Certification: ISO 9001, ISO 14001

Main Products: Bluetooth Module, BLE Module, Wi-Fi Module, Sub-1GHz Module, Zigbee Module, Lora Module

Company Introduction: Shenzhen RF-star Technology Co., Ltd., founded in 2010, is a world leading Internet-of-Things (IoT) solution provider. RF-star has the vision of a connected world with widely deployed IoT technology, such as BLE/BT (CC2540, CC2541, CC2640, CC2642, CC2652R, CC2652P, EFR32BG22, nRF51822, nRF51802, nRF52810, nRF52811, nRF52832, nRF52840, nRF52805, nRF52833, RS02A1-A, RS02A1-B), Wi-Fi (CC3200, CC3220, CC3235S, CC3235SF, RTL8710AF, RTL8711AF), LoRa (SX1278, SX1276, SX1262, SX1268, ASR6501, ASR6505), ZigBee (CC2530, EFR32), Sub-1GHz (CC1310, CC1352, CC1352P), RFID, which makes RF-star focus on creating innovative products and services, empowering industries to run intelligently and providing people better lifestyle.

RF-star, a third-party partner (IDH) of Texas Instruments (TI), is aimed to provide the superior wireless connectivity modules, customized RF HW and SW design. We also provide iPhone / Android APP design and the middleware for cloud service, which make RF-star a top-ranking RF system integrator in consumer electronics, industry and military and other fields. What's more, RF-star is highly praised by industry leaders such as TI, Nordic, Qualcomm, Huawei and Realtek.

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