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Advanced Chip Scale Package Acsp LED 0510 Flip Chip White and Red Backlight Car/Aotumotive Light Module 2700K-6500K

Name: Advanced Chip Scale Package Acsp LED 0510 Flip Chip White and Red Backlight Car/Aotumotive Light Module 2700K-6500K
Brand: Hgc (Wuhan) Technology Co., Ltd.
SKU: TJaRrZBKVEhG
Price: 0.10 USD
Availability: InStock

US$0.10 1 Piece (MOQ)

Port:

Shanghai, China

Production Capacity:

1000000/Week

Payment Terms:

L/C, T/T, Western Union, Paypal, Money Gram

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Hgc (Wuhan) Technology Co., Ltd.

Hubei, China

Last Login Date:

Feb 03, 2023

Main Products:

UVC LED Chip, UVC Module, Vehicle Regulation LED Chip, Automotive Grade LED Chip, UVC Purifier, UVC Disinfection Tube, UVC Germicidal Tube, Mini LED Backlight, Micro LED Backlight, Horticultural Light

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Product Description

Company Info

Basic Info.

Model NO.

ACSP0510

LED Light Source

Hgc

Emitting Color

White and Red

1 LED Power

0.2W

LED Chips

Hgc

Waterproof

Trademark

OEM

Transport Package

OEM

Specification

ODM

Origin

China

Product Description

Advanced Chip Scale Package(ACSP) LED 0510 Flip Chip White and Red Light Backlight Car/Aotumotive Light Module 2700K-6500K

As the trend towards smaller, lighter and thinner luminaires continues to gain momentum, LED manufacturers-including, HGC has responded by shrinking the size of their LED packaging. One result of this trend is the growing popularity of Chip Scale Package (CSP) technology. CSP technology eliminates the traditional submount to directly attach the LED die to the PCB, allowing for overall system cost reductions. As fully functional LED packages that are equal to or slightly larger than the size of a die, CSPs are increasingly being implemented in lighting designs.

HGC Advanced CSP (ACSP) Flipchip Speciality and Tech. Data Sheet.

1.This White Colored is ACSP FlipChip comes in standard package dimension.
2. Industry-leading line of Chip ScalePackage (ACSP) LEDs gives customers complete design flexibility.
3. ACSP includes the highest flux-density chip scale package, maximizing beam control and enabling high packing density on a PCB.
4. The package design coupled with careful selection of component materials allow these products to perform with high reliability.

Manufacturer	HGC	HGC	HGC
Part Number	HGC-DF10A002W60E	HGC-DF10A002BINA	HGC-DF10A002R62X
Product Name	ACSP0510	ACSP0510	ACSP0510
Application	Backlighting	Normal lighting & Automotive lighting	Normal lighting & Automotive lighting
Chip Technology	Flip Chip	Flip Chip	Flip Chip
Chromaticity Coordinate	B60	X/Y:(0.279,0.2878)	/
Colors	White	White	Red
Forward Current	20	20	120
Forward Current max (mA)	60	60	150
ESD	Class 3A JESD22-A114-E	Class 3A JESD22-A114-E	Class 3A JESD22-A114-E
Features	ACSP	ACSP	ACSP
Forward Voltage	2.7-3.0	2.7-3.0	3.0-3.4
Junction Temperature	150	150	150
Luminous Flux	4~7	4~10	/
No of Die	Yes	Yes	Yes
Operating Temperature	-40~ + 85	-40~ + 85	-40~ + 85
Package	0510	0510	0510
Package Type	ACSP	ACSP	ACSP
Pb Free	Yes	Yes	Yes
Power	0.2	0.2	0.2
Size	1.00.50.38	1.00.50.38	1.00.50.39
Soldering Temperature	260	260	260
Storage Temperature	-40 ~ + 100	-40 ~ + 100	-40 ~ + 100
Thermal Resistance	10ºC/W	10ºC/W	10ºC/W
Viewing Angle	140	140	140
Wave Length	/	/	620-635
CCT	/	2700-6500K	2700-6500K
Radiant Flux	/	/	15-35
Description	1,This White Colored is ACSP FlipChip comes in standard package dimension. 2,Industry-leading line of Chip ScalePackage (ACSP) LEDs gives customers complete design flexibility. 3, ACSP(FlipChip White) includes the highest flux-density chip scale package, maximizing beam control and enabling high packing density on a PCB. 4,The package design coupled with careful selection of component materials allow these products to perform with high reliability.	1,This White Colored is ACSP FlipChip comes in standard package dimension. 2,Industry-leading line of Chip ScalePackage (ACSP) LEDs gives customers complete design flexibility. 3, ACSP(FlipChip White) includes the highest flux-density chip scale package, maximizing beam control and enabling high packing density on a PCB. 4,The package design coupled with careful selection of component materials allow these products to perform with high reliability.	1,This Red Colored is ACSP FlipChip comes in standard package dimension. 2,Industry-leading line of Chip ScalePackage (ACSP) LEDs gives customers complete design flexibility. 3, ACSP(FlipChip White) includes the highest flux-density chip scale package, maximizing beam control and enabling high packing density on a PCB. 4,The package design coupled with careful selection of component materials allow these products to perform with high reliability.

HGC other Advanced UV LED Chip / Bead products and ODM modules

1. Wide application area: multiple sizes, high cost performance

2. Long service life: better performance than industry standards

3. UVC Sterilization band is concentrated and stable: at 260~280nm, high efficiency, energy saving and environmental protection

4. High UV penetration rate and high intensity, fast sterilization speed

5. The sterilization rate is as high as 99.99%, which can effectively kill a variety of bacteria including 2019 Virus Disease
6. Size and Power Customized with Small MOQ
7. More detail please mail to albert[AT]hgctech-lighting[DOT]COM

Address: 15a Floor, G6 Building, Future Science and Technology City, No. 999, Gaoxin Avenue, Donghu New Technology Development Zone, Wuhan City, Wuhan, Hubei, China

Business Type: Manufacturer/Factory

Business Range: Agriculture & Food, Auto, Motorcycle Parts & Accessories, Electrical & Electronics, Light Industry & Daily Use, Lights & Lighting

Management System Certification: ISO 9001, ISO 9000

Main Products: UVC LED Chip, UVC Module, Vehicle Regulation LED Chip, Automotive Grade LED Chip, UVC Purifier, UVC Disinfection Tube, UVC Germicidal Tube, Mini LED Backlight, Micro LED Backlight, Horticultural Light

Company Introduction: HGC LED Chip Factory Six Great Advantages:

1. UVC module

2. Flip Chip LED Chip DBR structure

3. High Power Automotive LED

4. Plant Illumination

5. Mini-LED

6. Full Spectrum Customized

7. (albert[AT]hgctech-lighting[DOT]COM)

DETAILS:

HGC Technology Co., Ltd. Was founded by an international team in 2017 and is headquartered in Wuhan, China. HGC owns the independent technology R&D center, focusing on LED packaging

And testing, innovation of premium light source chips and optical devices, etc. At the same time, HGC is also an innovative high-tech enterprise with a number of core patented technologies. Since its establishment, HGC has undertaken many key government researching projects in China.

Our R&D center member consists of highly educated scientific research talents and professional, experienced LED chip engineers. The photoelectric performance of self-developed flip LED,

Vertical LED, high voltage LED, mini / micro LED chips and the concerned packaging devices, semiconductor optical devices have gone to the world top level. They are widely used in

Automotive light source, special light source and display / backlight market. At present, HGC has successfully cooperated with well-known automotive manufacturer and also been listed as a

Qualified supplier of gaint display panel manufacturer.

HGC has completed the B1 round of financing so far, with a cumulative financing amount of several hundreds million yuan. Strategic investors include Haier and Lenovo capital, etc.

( albert[AT]hgctech-lighting[DOT]COM )

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