TSC-351 3.5G Wireless HSUPA Modem
| Negotiable | (MOQ) |
Production Capacity:
10000PC/Month
Transport Package:
CD Box
Hongkong S.A.R.
Last Login Date:
Feb 11, 2011
Main Products:
Hsdpa Modem, Hsupa Modem, Edge Modem, Cdma Modem, Evdo Modem, 3g Data Card, 3g Air Card
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Product Description
Company Info
Address:
Flat C, 23/F, Lucky Plaza, 315-321 Lockhart Road, Wan Chai, Hong Kong
Business Type:
Manufacturer/Factory
Business Range:
Computer Products, Consumer Electronics
Main Products:
Hsdpa Modem, Hsupa Modem, Edge Modem, Cdma Modem, Evdo Modem, 3g Data Card, 3g Air Card
Company Introduction:
Shenzhen Transcom Technology Co., Ltd. was established in 2003., and rebuild in 2010. Our company adheres to the concept of "Connect with world, Speed Your Life ". Our company focuses on the research and development, marketing and service of WCDMA/EDGE/CDMA2000 wireless products. We provide OEM wireless data cards for many overseas well-known brands and program solutions for domestic well-known notebook brands. At the same time, we have technological communication and co-operation with the leading companies in this industry.
Our company continues to focus on the technology research and accumulation of wireless data communication products and embedded systems. We make product research and development and customer service for our own core competitiveness. We make it our own responsibility to enhance partners' product competitiveness and innovation capacity. Therefore, we get deep trust and strong support from well-known customers and suppliers.
With the pace of science and technology in the new era, Transcom Tech will be more senior; The market will be more international and the capital will be more abundant. We positively face the challenges and try our best to create value for customers. Let us create a beautiful future together!
Our company continues to focus on the technology research and accumulation of wireless data communication products and embedded systems. We make product research and development and customer service for our own core competitiveness. We make it our own responsibility to enhance partners' product competitiveness and innovation capacity. Therefore, we get deep trust and strong support from well-known customers and suppliers.
With the pace of science and technology in the new era, Transcom Tech will be more senior; The market will be more international and the capital will be more abundant. We positively face the challenges and try our best to create value for customers. Let us create a beautiful future together!
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