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      PCB
      US$1.00-4.00 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 Pieces US$4.00

      10-999 Pieces US$3.00

      1,000-9,999 Pieces US$2.00

      10,000+ Pieces US$1.00

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Complex
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand OEM
      • Transport Package Carton Box
      • Specification 200 PCS/CTN
      • Trademark Customer's brand
      • Origin China
      • Surface Treatment Gold Finger/Hard Gold
      • Layers 1-36layers
      • Board Thickness 0.2-6mm
      • Copper Thickness 0.5-12oz(18-420um)
      • Solder Mask Color Green/Black/White/Red/Blue/Yellow
      • Hole Diameter Min0.05mm
      • Min. Line Width 0.10mm(4mil)
      • Min. Line Spacing 0.10mm(4mil)
      • Test 100% E-Test
      • One Stop Service PCB Assembly, Component Sourcing, Box Building
      • Max. Finished Board Side 1020mm*1000mm
      • Certification CE, RoHS, UL, SGS, ISO, FCC, TUV
      • PCB QA E-Test, Aoi, X-ray, Function Test
      • Sample Date 5-7days
      • Shipment Air, Sea, Express(DHL TNT FedEx EMS UPS)

      Product Description

      ... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m², almost 550 ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$1.00-4.00 / Piece US$0.90-99.99 / PCS US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 PCS 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Product Certification CE, RoHS, UL, SGS, ISO, FCC, TUV - - - -
      Management System Certification Others - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: OEM;
      Surface Treatment: Gold Finger/Hard Gold;
      Layers: 1-36layers;
      Board Thickness: 0.2-6mm;
      Copper Thickness: 0.5-12oz(18-420um);
      Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
      Hole Diameter: Min0.05mm;
      Min. Line Width: 0.10mm(4mil);
      Min. Line Spacing: 0.10mm(4mil);
      Test: 100% E-Test;
      One Stop Service: PCB Assembly, Component Sourcing, Box Building;
      Max. Finished Board Side: 1020mm*1000mm;
      PCB QA: E-Test, Aoi, X-ray, Function Test;
      Sample Date: 5-7days;
      Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
      Type: Rigid Circuit Board;
      Dielectric: F4btms1000;
      Material: Ceramic-Filled PTFE Composite;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Wangling;
      Surface Finish: Bare Copper;
      Board Thickness: 6.4mm (Finished);
      Layer Count: 2-Layer;
      Solder Mask: None;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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