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OEM/ODMSample OrderFiberglass Epoxy

High-Density Interconnect PCB Assembly and PCB for Data Centers

Name: High-Density Interconnect PCB Assembly and PCB for Data Centers
Brand: Shenzhen Hemeixin Electronic Co., Limited
SKU: wAJriZvYhpVI
Price: 0.10 USD
Availability: InStock

By?Shenzhen Hemeixin Electronic Co., Limited

US$0.10 - 1.00

1?Piece?(MOQ)

Customization

Available

Type

Rigid Circuit Board

Dielectric

FR-4

Material

Fiberglass Epoxy

Application

Consumer Electronics

Samples

US$5.00/Piece

Shipping Cost:?

Contact the supplier about freight and estimated delivery time.

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