OEM/ODMFiberglass Epoxy Resin + Polyimide Resin
BGA Multilayer Mobile Phone PCB Board Manufacturing
US$110.00 - 130.00
2?Square Meters?(MOQ)
Customization
Available
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy Resin + Polyimide Resin
Flame Retardant Properties
V0
PP Thickness
7628(0.18mm) 2116(0.12mm) 1080(0.08mm)
Shipping Cost:?
Contact the supplier about freight and estimated delivery time.
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