OEM/ODMBeO
Excellent Insulation High Mechanical Strength High Thermal Conductivity Alumina Ceramic Substrate
US$20.00 - 25.00
10?Pieces?(MOQ)
Customization
Available
Application
Electronic Devices, Lighting, Power Supply, Semiconductors
Conductive Layer
Thick Copper Layer
Material
BeO
Process
Direct Bonded Copper
Thickness
0.25, 0.32, 0.38, 0.5, 0.635, 0.76, 1, 2mm
Shipping Cost:?
Contact the supplier about freight and estimated delivery time.
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