AlN
High Thermal Conductivity Aln Aluminum Nitride Ceramic Substrates
US$1.00 - 50.00
1?Piece?(MOQ)
Application
Electronic Devices, Power Supply, Semiconductors
Material
AlN
Process
Direct Bonded Copper
Thickness
Customized
Flexural Strength
450MPa
Surface Roughness
Ra 0.3-0.5
Shipping Cost:?
Contact the supplier about freight and estimated delivery time.
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