OEM/ODMAl2O3
Low Thermal Expansion Coefficient Dbc Alumina Ceramic Substrate
US$1.00 - 10.00
1?Piece?(MOQ)
Customization
Available
Application
Electronic Devices
Conductive Layer
Thick Copper Layer
Material
Al2O3
Process
Direct Bonded Copper
Thickness
0.38 mm
Shipping Cost:?
Contact the supplier about freight and estimated delivery time.
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