OEM/ODMAlN
Customized Aluminum Nitride Substrate with Holes for Heat Sink / Heat Dissipation
US$1.00 - 10.00
10?Pieces?(MOQ)
Customization
Available
Application
Electronic Devices, Lighting, Power Supply, Semiconductors
Conductive Layer
Thick Copper Layer
Material
AlN
Process
Direct Bonded Copper
Thickness
0.25, 0.32, 0.38, 0.5, 0.635, 0.76, 1, 2mm
Shipping Cost:?
Contact the supplier about freight and estimated delivery time.
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